F & K Delvotec

F&K Delvotec is a respected technological leader in the field of Automated Assembly Equipment for the Microelectronic Industry. 

Having started with the classic die attach and wire bonding technology, we are now offering the broadest range of bonding equipment with the latest state-of-the-art technology. We are specialized in serving the very demanding niche markets where automated processes could not otherwise find success because of either very high demands on quality or very low volumes. 

F&K Delvotec has had excellent success providing equipment for Automotive Sensors and very difficult to bond passive components such as SAW-Devices or Micromechanical Actuators for Magnetic Data Storage Devices. 

F&K Delvotec is the only manufacturer supplying machines covering the complete spectrum of wire bonding technologies: gold ball bonding, gold ball bumping, wedge bonding for fine gold, aluminium wire and ribbon, wedge bonding for power devices with heavy aluminium wire.

F&K Delvotec continues its leadership in automation on microwave, telecommunication, and opto-electronic applications.