- Component (86)
- Machine (153)
- Automatic Optical Inspection System (2)
- Automatic Testing Equipment (4)
- Chip Shooter/Flexible Mounter (6)
- Coating Equipment (6)
- Contour Projector (2)
- Dispensing Machine (5)
- Environmental Test Chamber (2)
- Glass Inspector (1)
- Interferometer (1)
- Ionic Contamination Testing (2)
- Laser Cleaning System (1)
- Memory and Microcontroller Programmer (13)
- Microscope (2)
- Nozzle Cleaning System (1)
- Plasma Cleaning System (4)
- Reflow Soldering System (5)
- Router/Depanelizer/ Dry-Dicer (19)
- Screen Printer (2)
- Selective Soldering System (7)
- Semiconductor Curing Oven (4)
- SmartScope Measurement System (3)
- SMD Rework Station (12)
- Solder Paste Inspection System (3)
- Solder Paste Mixer (2)
- Soldering Robot (3)
- Stencil Cleaning System (5)
- Surface Profiler (2)
- Temperature Profiler (8)
- Thermal Shock Chamber (2)
- Through-Hole Rework Station (3)
- Ultrasonic Cleaner (1)
- Ultrasonic Energy Meter (1)
- Vacuum Sealer (7)
- Wave Soldering System (5)
- Wire Bonder (6)
- X-ray System (1)
Product Catalog
F & K Delvotec G5/64000 Thin Wire Wedge-Wedge Bonder |
|
F & K Delvotec G5/64000 thin wire wedge-wedge bonder covers the entire spectrum of thin wire applications optionally with 45° or 60 ° wire guide. It is the only wedge bonder worldwide which can be adapted to other processes in the minimum time of less than 20 minutes. Its dynamic bond head is based on the latest development and enables higher loop checks and a special wire guide.
Bond Head Specifications
|
Previous Page
|
More Machine Products |


