F & K Delvotec G5/64000 Thin Wire Wedge-Wedge Bonder

Bookmark and Share
F & K Delvotec G5/64000 Thin Wire Wedge-Wedge Bonder

F & K Delvotec G5/64000 thin wire wedge-wedge bonder covers the entire spectrum of thin wire applications optionally with 45° or 60 ° wire guide. It is the only wedge bonder worldwide which can be adapted to other processes in the minimum time of less than 20 minutes. Its dynamic bond head is based on the latest development and enables higher loop checks and a special wire guide.

  

  

  

Bond Head Specifications
  • 17 to 75 μm wire diameter
  • Bond force programmable from 10 to 250 cN
  • Standard wire feed, 45° wire feed angle (optional: 60°)
  • 2" wire spool

 
Previous Page More Machine Products