F & K Delvotec G5/64000DA Deep Access Bonder
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F & K Delvotec G5/64000DA Deep Access Bonder

With the G5/64000DA model F & K Delvotec presents the deep-access version for especially demanding thin-wire applications. The machine also processes thin-ribbon materials and has a 90° wire guide for deep components. This bonder, too, can be retooled for other processes in less than 20 minutes. Its outstanding features include the newly developed dynamic bond head for dynamised and optimised loop checking.

 

 

Bond Head Specifications
  • 17 to 75 μm wire diameter
  • Ribbon up to 250 μm x 50 μm
  • Bond force programmable from 10 to 250 cN
  • 90° wire or ribbon feed
  • 2" wire spool
  • Single wire clamp, cascadable with support clamp for secure tear

 
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