PARMI SPI50T for Solder Paste Printing Process Control
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It is well known that defects of assembled PCBs are mainly related to the solder paste printing process. The trend toward applying very small device such as 0201 chip and CSP spread widely beyond the SMT assembly industry, and the lead free soldering exposures much more possibility of SMTA failures.

PARMI SPI 50T is the most optimal off-line system for solder paste printing process monitoring and analysis. Its high inspection speed makes SPI 50T accommodate a few SMT lines simultaneously.

 

Inspection Accuracy
  • Inspection Type: Height, Area, Volume, Offset, Bridge
  • Inspection Speed: 30 sq.cm/sec
  • Load, Unload Time: 1 sec
  • Height Repeatability: 3 Sigma < 1.5 µm, on a certification target
  • Area Repeatability: 3 Sigma < 3%, on a certification target
  • Volume Repeatability: 3 Sigma < 3%, on a certification target
  • Height Accuracy: 3 µm, on a certification target
  • Gage R&R: Less than 10 %
Datasheet Download

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