PARMI SPI HS60 3D Solder Paste Inspection System
Bookmark and Share
PARMI SPI HS60 3D Solder Paste Inspection System

The SPI HS60 is a 3D solder paste inspection system that provides the most reliable and accurate 3D data. Using PARMI's innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder material, paste shape, and warpage.

This highest quality of 3D data backs up top level performance of SPI HS60 system concerning about the reliability and accuracy. And It’s due to PARMI’s unique signal processing technology that is implemented as hardware logic.

 

 

Inspection Accuracy
  • Inspection Type: Height, Area, Volume, Offset, Bridge
  • Inspection Speed: 30 sq.cm/sec (High Resolution), 60 sq.cm/sec (High Speed)
  • Load, Unload Time: 1 sec
  • Height Repeatability: 3 Sigma < 1.5 µm, on a certification target
  • Area Repeatability: 3 Sigma < 3%, on a certification target
  • Volume Repeatability: 3 Sigma < 3%, on a certification target
  • Height Accuracy: 3 µm, on a certification target
  • Gage R&R: Less than 10 %
Datasheet Download

Note: You need to login in order to download the brochure. You may login or register as user here.

 
Previous Page More Machine Products