PARMI SPI 2500 3D Solder Paste Inspection System

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PARMI SPI 2500 3D Solder Paste Inspection System

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. 

 

 

Highlights
  • The optimal solution for monitoring and analysis of solder paste printing process.
  • Measures Height, Volume, and Area of solder paste with the utmost accuracy
  • Suitable for checking the CSP and fine pitch QFP paste locations.
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