Zevac's PCBRM 5.2 system is used for selective soldering & rework of through hole components. It includes the PCBRM15 module, two zones, 18"x14" preheater (6500 watts) and non-contact temperature sensor. With the preheater, PCBRM 5.2 provides
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Reduced time and temperature requirements for heat absorbing assemblies or high heat alloys (lead-free)
- Minimal thermal shock, localized PCB warpage and no component overheating.
- Flux activation prior to soldering
- Ability to rework thick board assemblies.
The PCBRM15 module includes solder pot, pumping system, precise operating controls and x, y, z alignment system.
Operation
- Components can be accurately located over a wave of molten solder whose shape matches the lead pattern.
- A volume of solder flows for only seconds against the bottom of the board, transmitting heat to the leads. When joints are molten, the component is removed.
- Holes are then cleaned with low pressure air and new component inserted and resoldered.
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PCBRM System 5.2 Technical Data
- Physical Dimension: 76"W x 33"D x 28"H
- Board Carrier Size: 24"W x 20"D
- Solder Capacity: 35 lbs
- Weight with Solder: 230 lbs
- Compressed Air: 40-80 psi, clean moisture free
- Electrical: 45 amps @ 220V, 50/60Hz, 10000 watts
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PCBRM15 Technical Data
- Physical Dimension: 32"W x 32"D x 26"H
- Solder Capacity: 35 lbs
- Weight with Solder: 125 lbs
- Compressed Air: 40-80 psi, clean moisture free
- Electrical: 209/220V, 45 amps @ 220V, 50/60Hz single phase, 2500 watts
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