Zevac SSM 4 Through-Hole Rework Station
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Zevac SSM4 Through-Hole Rework Station

Zevac's SSM 4 is meant for selective soldering and desoldering of Through Hole Technology applications. Reproducible results by operation parameters.

The SSM 4 is the entry machine version of the SSM series. It is outlined for fast selective soldering and desoldering options for changing applications.

Applications include repair, prototyping, soldering, retrofit and small series production on the entire field of selective soldering and desoldering in the Through Hole Technology. Defective components can be removed and new components soldered in place even on dense-populated, mixed technology and / or multilayer printed circuit boards.

Depending on the design of the board the flow off sides can be from one to all 4 sides of a flow well. The combination of flow well design and parameter settings assure the continuous flow of the liquid solder in the desired way. The flow wells and / or cleaning hoods can be used on all machines of the SSM series.

Features
  • EASY TO USE ENTRY MODEL: for leaded or leadfree operation
  • ADJUSTABLE PARAMETERS
  • STABLE CONSTRUCTION: stable table top machine.
  • VARIOUS OPTIONS: like board holder, blow out system or protective gas operation.
  • APPLICATION SPECIFIC TOOLING: for any kind of component also on dense populated board, including multi soldering solutions, for wetting on defined positions.
  • RETROFIT FOR LEADFREE: leadfree retrofit for machines already in operation available.

 
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