Zevac SSM 9 Through-Hole Rework Station

Product Catalog

Through-Hole Rework Station

Zevac's SSM 9 is meant for selective soldering and desoldering of Through Hole Technology applications. Reproducible results by programmable parameters.

The SSM 9 is ideal for a wide range of soldering applications. Parameters like solder temperature, cycle time, wave height, ramp up and down can be programmed to realize operator independent and reliable solder results. The parameters are entered via the operating panel and up to 10 programs can be stored and repeated on demand

Applications include repair, prototyping, soldering, retrofit and small series production on the entire field of selective soldering and desoldering in the Through Hole Technology. Defective components can be removed and new components soldered in place even on dense-populated, mixed technology and / or multilayer printed circuit boards.

The selective soldering and desoldering machine SSM 9 can be combined with the standalone preheater module PH4 to preheat the printed circuit board smoothly up to the predefined working temperature. Detail description PH4.

Features

FLEXIBLE SOLUTIONS: for standard or odd shaped components
PROGRAMMABLE PARAMTERS:can be stored and recalled on demand
HEIGHT ADJUSTMENT: easy height adjustment of the printed circuit board over the flow well
STABLE CONSTRUCTION: easy to use and stable table top machine.
BOARD HOLDER: even irregular shaped printed circuit boards up to 840x600mm can be fixed on the quick locking board holder.
BLOW-OUT OPTION: to clean the solder joints after removal of a connector.
APPLICATION SPECIFIC TOOLING: for any kind of component also on dense populated board, including multi soldering solutions, for wetting on defined positions.
PREHEATER MODULE PH4: The standalone preheater module PH4 can be connected, especially for the increased lead-free requirements.
RETROFIT FOR LEADFREE: leadfree retrofit for machines already in operation available.

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